Used as a high-performance curing agent and crosslinking agent in epoxy resin systems, particularly in aerospace and electronic applications due to its excellent thermal stability and mechanical strength. Enhances flame resistance and chemical resistance in cured resins. Commonly employed in composite materials, encapsulants, and insulating varnishes where long-term durability at elevated temperatures is required. Also utilized in the synthesis of polyimides and other specialty polymers for advanced engineering plastics and films.