N1,N4-Dicyclohexylbenzene-1,4-diamine
95%
science Other reagents with same CAS 4175-38-6
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description Product Description
Used as a curing agent in high-performance epoxy resins, particularly in applications requiring excellent thermal stability and mechanical strength. Commonly found in aerospace composites, electrical insulation systems, and structural adhesives due to its ability to form durable, heat-resistant networks. Also utilized in specialty coatings where chemical and moisture resistance are critical. Its symmetrical structure contributes to uniform cross-linking, enhancing the final material’s performance under extreme conditions.
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