Used as a high-performance diamine monomer in the synthesis of polyimides and polyamides, offering excellent thermal stability and mechanical strength. Commonly applied in aerospace, electronics, and semiconductor industries for manufacturing heat-resistant coatings, flexible printed circuits, and insulating materials. Its rigid molecular structure enhances the glass transition temperature and dimensional stability of resulting polymers, making it suitable for demanding environments requiring long-term reliability. Also utilized in advanced composite materials and as a crosslinking agent in specialty resins.