Used as a key intermediate in the synthesis of high-performance polyamides and polyimides, this compound contributes to the development of heat-resistant polymers employed in aerospace, electronics, and advanced composite materials. Its diamine structure enables strong intermolecular bonding, enhancing thermal and mechanical stability in the resulting polymers. It is also utilized in the preparation of specialty dyes and UV-absorbing compounds for protective coatings and optical applications. Additionally, its reactivity makes it suitable for crosslinking agents in high-temperature curing systems.