Used as an intermediate in the synthesis of high-performance polyimides and polyamides, offering excellent thermal stability and mechanical strength for applications in aerospace, electronics, and specialty coatings. Its unique branched alkyl structure enhances solubility in organic solvents, improving processability in polymer manufacturing.

Also employed in the development of advanced resins for printed circuit boards and encapsulation materials due to its low dielectric properties and resistance to moisture.

Additionally, finds use in specialty adhesives and sealants requiring durability under extreme conditions.