Used as a high-performance diamine curing agent in epoxy resin systems. Offers excellent thermal stability and mechanical strength, making it suitable for aerospace, electronics, and advanced composite materials. Its rigid molecular structure enhances glass transition temperature (Tg) of cured epoxies, improving performance under high-temperature conditions. Commonly applied in encapsulants, adhesives, and printed circuit boards where durability and heat resistance are critical. Also utilized in specialty coatings and insulating materials due to low dielectric constant and good electrical insulation properties.