Used as a curing agent and crosslinking agent in epoxy resin systems, providing high thermal stability and mechanical strength to the cured resins. Commonly applied in electronic encapsulants, coatings, and composite materials where enhanced performance under high-temperature conditions is required. Its rigid bicyclic structure contributes to low dielectric constants, making it suitable for advanced printed circuit boards and semiconductor packaging. Also utilized in specialty polymers and as a building block in the synthesis of high-performance materials.