Used primarily as a curing agent for epoxy resins, enabling the formation of thermoset polymers with excellent electrical insulation, thermal stability, and mechanical strength. Commonly applied in the electronics industry for encapsulating semiconductors, insulating motors, and manufacturing printed circuit boards. Its low volatility and good reactivity make it suitable for casting and impregnation processes where high reliability is required. Also utilized in composite materials for aerospace and electrical coatings due to its resistance to moisture and chemicals.