Used as a cross-linking agent in high-performance polymers, enhancing thermal and chemical resistance in coatings and composites. Employed in the synthesis of advanced polyimides for aerospace and electronics due to its ability to form stable, rigid molecular structures. Also utilized in specialty resins for insulating materials and in the development of heat-resistant adhesives. Shows potential in organic electronics and as a building block for functional porous materials like metal-organic frameworks (MOFs).