Used primarily as a curing agent or hardener for high-performance epoxy resins, especially in aerospace and electrical insulation applications. It provides excellent thermal stability, mechanical strength, and resistance to moisture, making it ideal for composites, printed circuit boards, and structural adhesives. Also employed in the production of thermosetting plastics and as a crosslinking agent in coatings requiring durability at elevated temperatures. Its use extends to specialty polymers where long-term reliability under stress is critical.