4,4'-Diaminodiphenyl sulfone

97%

Reagent Code: #126894
label
Alias 4,4'-diaminodiphenylsulfone ;4-aminophenylsulfone, dapsone, 4,4'-sulfonyldiphenylamine, bis(4-aminophenyl)sulfone
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CAS Number 80-08-0

science Other reagents with same CAS 80-08-0

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 248.3 g/mol
Formula C₁₂H₁₂N₂O₂S
badge Registry Numbers
EC Number 201-248-4
MDL Number MFCD00007887
thermostat Physical Properties
Melting Point 175-177 °C(lit.)
inventory_2 Storage & Handling
Storage Room temperature, dry, sealed

description Product Description

Used primarily in the production of high-performance polymers, particularly epoxy resins, which are essential in aerospace, automotive, and electronics industries due to their thermal stability and mechanical strength. It serves as a curing agent, enhancing the durability and resistance of these materials under extreme conditions. Additionally, it is employed in the synthesis of polyimide films, which are used in flexible printed circuits and insulation materials. In the pharmaceutical sector, it acts as a precursor in the manufacture of certain antibacterial drugs, particularly for treating leprosy and dermatitis herpetiformis. Its role in these applications highlights its versatility in both industrial and medical fields.

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Test Parameter Specification
Melting Point 173-181
Purity 97-100
Appearance White To Beige Powder Or Crystals
Infrared Spectrum Conforms To Structure
Solubility in Hot Methanol Almost transparent

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 50g
10-20 days ฿460.00
inventory 2.5kg
10-20 days ฿6,990.00
inventory 1kg
10-20 days ฿2,960.00
inventory 500g
10-20 days ฿1,800.00
inventory 100g
10-20 days ฿600.00

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4,4'-Diaminodiphenyl sulfone
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Used primarily in the production of high-performance polymers, particularly epoxy resins, which are essential in aerospace, automotive, and electronics industries due to their thermal stability and mechanical strength. It serves as a curing agent, enhancing the durability and resistance of these materials under extreme conditions. Additionally, it is employed in the synthesis of polyimide films, which are used in flexible printed circuits and insulation materials. In the pharmaceutical sector, it acts as

Used primarily in the production of high-performance polymers, particularly epoxy resins, which are essential in aerospace, automotive, and electronics industries due to their thermal stability and mechanical strength. It serves as a curing agent, enhancing the durability and resistance of these materials under extreme conditions. Additionally, it is employed in the synthesis of polyimide films, which are used in flexible printed circuits and insulation materials. In the pharmaceutical sector, it acts as a precursor in the manufacture of certain antibacterial drugs, particularly for treating leprosy and dermatitis herpetiformis. Its role in these applications highlights its versatility in both industrial and medical fields.

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