Used as a specialty reactive epoxy monomer in high-performance composite materials. Its unique spirocyclic structure provides excellent thermal stability and mechanical strength in aerospace and electronics applications. Commonly employed in encapsulation of sensitive electronic components due to low dielectric constant and high moisture resistance. Also utilized in advanced adhesives requiring strong bonding with minimal shrinkage. The rigid aza-spirocyclic framework enhances glass transition temperature in cured resins, making it suitable for high-temperature environments. Additionally, serves as a synthetic intermediate for complex spiro and bicyclic compounds in pharmaceutical development.