Used primarily in epoxy resin systems to initiate and control the curing process, enabling the formation of durable, chemically resistant, and mechanically strong networks. Widely applied in coatings, adhesives, sealants, and composite materials for industries such as automotive, aerospace, construction, and electronics. Offers excellent adhesion to various substrates and can be tailored for room temperature or elevated temperature curing. Provides good moisture resistance and electrical insulation properties, making it suitable for protective coatings and encapsulation of electronic components. Some formulations are designed for low volatility and reduced skin irritation, supporting safer handling in industrial and field applications.