Used primarily in epoxy resin systems to initiate and control the curing process, enabling the formation of strong, durable, and chemically resistant networks. Widely applied in coatings, adhesives, sealants, and composite materials for industries such as automotive, aerospace, construction, and electronics. Offers excellent mechanical properties and adhesion to various substrates. Suitable for both ambient and elevated temperature curing, providing flexibility in manufacturing processes. Also used in civil engineering for grouting and structural bonding due to high load-bearing capacity and long-term stability.