Used primarily in epoxy resin systems to initiate and control the curing process, enabling strong cross-linking between polymer chains. This results in durable, chemically resistant coatings, adhesives, and composite materials. Commonly applied in industrial flooring, marine coatings, and structural adhesives due to its excellent mechanical strength and thermal stability. Also utilized in electrical encapsulation and potting compounds for insulation and protection of electronic components. The curing agent allows adjustable pot life and cure speed, making it suitable for both ambient and elevated temperature applications.