Used primarily as a fast-acting adhesive in specialty bonding applications, particularly in electronics, optics, and precision instrument assembly. Its rapid curing on contact with moisture makes it ideal for bonding small, sensitive components where heat or pressure cannot be applied. Exhibits strong adhesion to metals, plastics, and ceramics while maintaining clarity and minimal residue. Also utilized in forensic science for fingerprint development due to its ability to fume and adhere to latent print residues. Commonly found in microscale repair work, including medical devices and jewelry, where precision and strength are critical.