Poly(α-methylstyrene)

Mw 300000

Reagent Code: #128527
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CAS Number 25014-31-7

science Other reagents with same CAS 25014-31-7

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inventory_2 Storage & Handling
Storage 2-8°C

description Product Description

Poly(α-methylstyrene) is a specialty polymer valued for its unique thermal depolymerization properties, decomposing cleanly back to its monomer at relatively low temperatures (around 200-250°C) without leaving residue. It is primarily used in the electronics industry, particularly in microlithography for semiconductor manufacturing. As a key component in photoresist formulations, especially bilayer resist systems, it enables precise patterning and lift-off processes in microchip fabrication. Its high purity and stability make it ideal for applications requiring high-resolution imaging and clean removal, such as in the production of integrated circuits and thin-film devices. Additionally, it serves as a sacrificial material in advanced coating and adhesive formulations where thermal recyclability is essential.

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Size Availability Unit Price Quantity
inventory 250mg
10-20 days ฿10,720.00

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Poly(α-methylstyrene)
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Poly(α-methylstyrene) is a specialty polymer valued for its unique thermal depolymerization properties, decomposing cleanly back to its monomer at relatively low temperatures (around 200-250°C) without leaving residue. It is primarily used in the electronics industry, particularly in microlithography for semiconductor manufacturing. As a key component in photoresist formulations, especially bilayer resist systems, it enables precise patterning and lift-off processes in microchip fabrication. Its high pur

Poly(α-methylstyrene) is a specialty polymer valued for its unique thermal depolymerization properties, decomposing cleanly back to its monomer at relatively low temperatures (around 200-250°C) without leaving residue. It is primarily used in the electronics industry, particularly in microlithography for semiconductor manufacturing. As a key component in photoresist formulations, especially bilayer resist systems, it enables precise patterning and lift-off processes in microchip fabrication. Its high purity and stability make it ideal for applications requiring high-resolution imaging and clean removal, such as in the production of integrated circuits and thin-film devices. Additionally, it serves as a sacrificial material in advanced coating and adhesive formulations where thermal recyclability is essential.

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